Process materials used in the manufacture of electronic semiconductors; load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal-growing chamber and monitor controls; locate crystal axis in ingot using x ray equipment and saw ingots into wafers; clean, polish, and load wafers into series of special-purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties. May scribe or separate wafer into dice.

1992 employment: 32,000 Projected 1992-2005 employment change: Little change expected

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